Samsung Poised to Start Mass Production of Next-Gen Memory for Nvidia

2026-01-26 companies

Suwon, Monday, 26 January 2026.
Samsung Electronics is reportedly preparing to mass-produce HBM4 chips for Nvidia as early as February 2026, a move that could significantly reshape the AI hardware supply chain. By exceeding data speed requirements for Nvidia’s upcoming Rubin platform, Samsung threatens to close the market share gap with current leader SK Hynix.

Production Timeline and Certification Status

Samsung Electronics (005930) has reportedly entered the final qualification phase with Nvidia (NVDA) for its sixth-generation high-bandwidth memory, HBM4, marking a pivotal step in its semiconductor strategy [4]. Industry sources indicate that the South Korean tech giant is preparing to commence mass production of these chips as early as February 2026, with the intent to supply them directly for Nvidia’s artificial intelligence accelerators [1][5]. This aggressive timeline suggests Samsung is effectively narrowing the gap with rival SK Hynix, which has dominated the HBM market to date [4]. If the certification is finalized as anticipated, Samsung will become a primary partner for Nvidia, potentially shipping the new units to both Nvidia and AMD as early as next month [3][7].

Technical Specifications and Manufacturing Strategy

The technical validation of Samsung’s HBM4 chips reveals a significant performance advantage. In recent qualification tests, the chips achieved data transfer speeds of up to 11.7 gigabits per second (Gbps), exceeding Nvidia’s requirement of 10 Gbps by 17 percent [6][7]. This performance is driven by Samsung’s decision to integrate its sixth-generation 10-nanometer (1c) DRAM process with a 4-nanometer foundry process for the logic die [6][7]. In comparison, SK Hynix employs a fifth-generation (1b) DRAM process paired with a 12-nanometer logic die manufactured by TSMC [7]. Industry experts note that Samsung’s manufacturing approach has been critical in meeting the stringent speed and thermal management demands of next-generation AI processors, while competitors like SK Hynix and Micron recorded lower speeds of approximately 8.3 Gbps and 8 Gbps, respectively, in specific comparison tests [7].

Market Reaction and Supply Chain Impact

The prospect of Samsung securing this deal triggered an immediate reaction in the equity markets on Monday, January 26. Shares of Samsung Electronics climbed 2.2%, while SK Hynix stock fell by 2.9%, reflecting investor sentiment shifting toward Samsung’s potential market share gains [1][5]. This development aligns with the broader infrastructure needs of Nvidia, whose CEO Jensen Huang confirmed earlier in January that the Vera Rubin platform—the likely destination for these HBM4 chips—is already in “full production” [1][5]. With the global supply of AI components facing bottlenecks, Samsung’s entry as a volume supplier is expected to be a crucial factor in sustaining the rollout of Nvidia’s advanced computing architectures [5][6].

Future Outlook and Earnings Focus

Attention now turns to the upcoming earnings calls, where the financial implications of these technical milestones will likely be clarified. Both Samsung and SK Hynix are scheduled to report their fourth-quarter results later this week, with analysts expecting detailed updates on HBM4 order volumes and production roadmaps [1][7]. While SK Hynix had previously announced the development of its HBM4 technology in September 2025, reports suggest the company is currently redesigning its chips and awaiting renewed evaluations [7]. This delay could provide Samsung with a strategic window to solidify its position with major clients like Nvidia and Google before competitors can fully ramp up their own next-generation supply lines [3][7].

Sources

Artificial Intelligence Semiconductors