latest news in Semiconductors
TSMC Advances Glass Packaging Technology to Boost Artificial Intelligence Chips
Hsinchu, Wednesday, 7 October 2026.
TSMC is deploying advanced glass-substrate technology to overcome the physical limitations of traditional packaging, boosting energy efficiency and production capacity for next-generation artificial intelligence chips.
Taiwanese Chipmaker Expands US Operations to Strengthen Supply Chains
Orlando, Monday, 5 October 2026.
WIN Semiconductors partnered with Florida-based SawStreet to provide U.S.-based backend processing, allowing delicate compound wafers to be thinned down to 50 micrometers while shortening production cycles.