Anker Introduces Proprietary AI Chip to Power Local Processing in Consumer Electronics
Changsha, Monday, 27 April 2026.
Launched today, Anker’s new THUS AI chip computes directly within memory cells, drastically cutting power use to bring fast, cloud-free local processing to everyday consumer electronics.
Rethinking Chip Architecture for Wearables
On April 27, 2026, consumer electronics manufacturer Anker Innovations (SZSE: 300866.SZ [GPT]) announced the THUS artificial intelligence chip platform [1]. This proprietary silicon represents a fundamental shift in processing for everyday electronics by embedding computation directly inside NOR Flash memory cells [1]. This compute-in-memory approach allows the neural network’s model parameters to remain stationary between the memory and processor, eliminating the traditional need to constantly move data during operation [1].
Debuting in Flagship Audio
The inaugural application of the THUS chip targets the audio sector, specifically integrating into the flagship true wireless earbuds under Anker’s Soundcore brand [1]. Internal laboratory tests indicate that the new chip supports several million model parameters [1]. This capacity enables up to 150 times more AI computing power dedicated to environmental noise cancellation (ENC) when compared to Anker’s previous-generation flagship earphones [1].
Manufacturing and Broader Ecosystem Expansion
The development of the THUS platform is the result of a strategic partnership with an unnamed global compute-memory technology company [1]. The chips are being fabricated in Germany, with Anker holding an exclusive license for the technology [1]. This manufacturing strategy ensures Anker maintains tight control over its proprietary hardware as it integrates the silicon across its product lines [1]. Anker has positioned THUS as a multi-year platform designed to scale beyond audio equipment into mobile accessories and Internet of Things (IoT) devices [1]. Full details regarding additional earbud features, such as Signature Sound and Voice Control, are scheduled to be unveiled at the upcoming “Anker Day” event in New York on May 21, 2026 [1].